PCB Design Engineer

MissionHires is seeking a PCB Design Engineer on behalf of a global embedded computing technology leader. This full-time, direct-hire role focuses on designing complex, high-density multilayer PCBs for rugged aerospace, defense, industrial, and embedded computing platforms. The ideal candidate brings strong Siemens Mentor Xpedition experience, advanced high-speed digital layout expertise, and a practical understanding of signal integrity, power integrity, and manufacturable PCB design.

• Develop sophisticated high-density, multilayer PCB layouts for advanced embedded computing products.
• Translate electrical schematics and hardware requirements into high-performance, manufacturable PCB designs.
• Collaborate with electrical, mechanical, manufacturing, systems, test, and hardware engineering teams throughout the product lifecycle.
• Design and route high-speed digital interfaces including DDR4/DDR5, GDDR, PCI Express Gen4/Gen5, Gigabit Ethernet, differential pairs, and controlled-impedance signals.
• Apply signal integrity, power integrity, DFM, DFA, and DFT principles to optimize electrical performance, reliability, manufacturability, and cost.
• Develop dense multilayer board stack-ups and implement HDI technologies such as microvias, blind and buried vias, via-in-pad, and sequential lamination.
• Support design reviews, fabrication activities, assembly, testing, production releases, and resolution of PCB-related technical issues.
• Create and maintain fabrication drawings, assembly documentation, manufacturing outputs, and other PCB release materials.
• Manage design constraints, component placement, routing challenges, design updates, and engineering change orders.
• Contribute to PCB libraries, design rules, layout methodologies, and process improvements as needed.

• Bachelor's degree in Electrical Engineering, Electronic Engineering, or a related discipline, or equivalent industry experience.
• At least 2 years of professional PCB layout experience using enterprise-class PCB design tools.
• Strong hands-on experience with Siemens Mentor Xpedition Layout, DxDesigner, design libraries, and constraint management tools.
• Experience designing complex, high-density multilayer PCBs for high-performance electronic products such as aerospace, defense, networking, telecommunications, embedded computing, automotive, or similar applications.
• Demonstrated ability to convert electrical schematics into complete, manufacturable PCB layouts while partnering closely with hardware engineers.
• Strong high-speed digital PCB design experience with DDR4/DDR5, GDDR, PCI Express Gen4/Gen5, high-speed Ethernet, controlled-impedance routing, and differential-pair routing.
• Experience designing dense multilayer PCBs, typically 14 to 24 or more layers, or designs of equivalent complexity.
• Knowledge of HDI technologies, including blind and buried vias, microvias, via-in-pad, sequential lamination, and advanced stack-up construction.
• Hands-on layout experience with BGA and fine-pitch BGA packages, QFN packages, high-pin-count FPGAs, surface-mount and through-hole components, and rigid or rigid-flex boards.
• Strong understanding of signal integrity, power integrity, PCB fabrication and assembly processes, DFM, DFA, and DFT.
• Experience creating PCB fabrication, assembly, and manufacturing documentation.
• Strong problem-solving skills and the ability to balance electrical performance, manufacturability, reliability, and cost.
• U.S. citizenship or permanent resident status is required.
• Experience with RF, analog, mixed-signal, or FPGA-based PCB layouts is preferred.
• Experience with PCB design migration from Altium, Cadence Allegro, PADS, Zuken, or PCAD to Xpedition is preferred.
• Familiarity with IPC standards, military specifications, and high-reliability PCB design practices is preferred.
• Experience supporting PCB libraries, design-rule development, ECO management, process improvements, or mentoring other PCB designers is preferred.
• Ability to use AI-assisted engineering tools productively while independently validating engineering accuracy is preferred.

• Competitive salary with annual performance incentives.
• Comprehensive medical, dental, and vision insurance.
• 401(k) retirement plan with company contribution.
• Generous paid time off and paid holidays.
• Career development and technical training opportunities.
• Collaborative engineering environment with direct access to technical leadership.
• Opportunity to work on advanced defense, RF, aerospace, and embedded computing technologies.
• Long-term career growth within a global engineering organization.
• Minimal travel requirements.